Elastomer Raw Materials for Hot-Melt Adhesives: Properties & Applications In the formulation process of hot-melt adhesives, the choice of elastomer raw materials is paramount, as each offers unique properties and fits specific application areas. The table below outlines the elastomer raw materials suitable for hot-melt adhesives, along with their respective temperature resistance, polarity, and application environments. Elastomer Max. Temp Min. Temp Polarity Suitable Substrates for Bonding Application Fields EVA 80°C - 100°C -20°C Low Low-polarity materials such as paper, wood, PE, PP, etc. Packaging, bookbinding, wood processing SIS 70°C - 90°C -40°C Low Low-polarity materials such as paper, labels, PE, PP, etc. Labels, hygiene products, packaging SBS 80°C - 100°C -40°C Low Low-polarity materials such as paper, PE, PP, rubber, etc. Footwear, tapes, packaging SEBS 90°C - 120°C -40°C Low Low-polarity materials such as PE, PP, rubber, textiles, etc. Automotive interiors, medical devices, electronics SEPS 100°C - 120°C -40°C Low Low-polarity materials such as PE, PP, rubber, textiles, etc. Automotive parts, electronic components, packaging TPU 120°C - 150°C -40°C High High-polarity materials such as PU, TPU, nylon, PET, etc. Footwear, apparel, automotive interiors TPEE 150°C - 180°C -40°C High High-polarity materials such as PET, nylon, metal, glass, etc. Automotive parts, industrial & electronic components PA 150°C - 180°C -40°C High High-polarity materials such as nylon, PET, metal, glass, etc. Textiles, automotive parts, electronic components PES 120°C - 150°C -40°C High High-polarity materials such as PET, nylon, metal, glass, etc. Apparel, footwear, packaging materials TPV 120°C - 150°C -40°C Medium Rubber, PP, PE, metal, etc. Automotive interiors, industrial & electronic components Silicone Rubber 200°C - 250°C -60°C Low Silicone, glass, metal, ceramics, etc. Aerospace, medical devices, electronic components Explanatory Note: This table is compiled based on the inherent characteristics of each material, demonstrating that different base polymers have their own most suitable application fields. In actual hot-melt adhesive production, when considering costs, formulation conditions, and processing techniques, developers can adjust the formulation using these existing base materials. By altering the high/low-temperature resistance and polarity of the adhesive, its application fields can be significantly expanded.
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